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|Other Cas No:||1344-70-3||EINECS No:||215-269-1|
|Melting Point:||1326℃||Cas No.:||185461-92-1|
cupric oxide nanoparticles
Levels electroplating active copper oxide, also known as electroplating copper oxide levels, electroplating copper oxide powder, plating nanometer active copper oxide, electroplating grade copper oxide is made up of less active atomic or molecular aggregation and composition, molecular particles below 1 um, several times larger than the surface area than ordinary copper oxide, high content, low impurities, such as the powder is fine and uniform characteristics.
The product has higher activity and faster dissolution rate.
The liquid electrical performance of the product is stable,
The product has little effect on the plating additive, and the electroplating effect is stable.
Contact Person: andrew.liao