Semiconductor Material Oxide Nanoparticles Copper Oxide Nano Powder 98.5% Purity

Ultrafine Active 98.5% Copper Oxide Nano Powder Cas No 1317-38-0 for Semiconductor Material

Appearance: black powder.

Decomposition products: copper oxide, oxygen.

Banned: strong reducing agent, aluminum, alkali metal.

property: slightly hygroscopic, insoluble in water and ethanol, soluble in acid, ammonium chloride and potassium cyanide solution, slowly dissolved in ammonia solution, can react with strong base.

1, advanced purification technology: in the process of purification, the use of independent research and development of additives greatly improve the purity of product, decided the products with high copper content, do not contain organic impurities, metal impurity content is low, low chloride content features.It is used to supplement the copper salt.
2. Ultrahigh activity: low temperature conversion process is adopted in the production process, and grain growth is carried out at lower temperatures to control the agglomeration between particles, ensuring the super-high activity of copper oxide.The copper ion in the plating solution can be replenished in time to maintain the stable copper content.
3, fast dissolving rate: can quickly dissolve completely in the plating bath liquid, guarantee the clean of plating bath fluid, prevent the adsorption of liquid medicine additive, effective control of additives in the electroplating bath ratio change, stability provides a reliable guarantee of plating quality.
4. Strong stability: the strict process control and perfect quality management process in the production process guarantee the stability of the batch.

Certificate of Analysis